PURPOSE: To remove resin burrs between a tie bar cutting process and a lead molding process by a method wherein a sweeping device for removing the resin burrs on a lead frame is provided between a tie bar cutting device and a lead molding equipment and a dust collector is provided in the vicinity of the sweeping device.

CONSTITUTION: A resin sealing finished lead frame 12, which is moved on a frame conveying rail 3, in conveyed on a bottom force 26 of a tie bar cutting device 15 and is tie bar-cut by making a top force 25 drive. Then, resin burrs 13 are removed by a sweeping device 11 and are sucked in a dust collector 2. At this time, if a motor 17 is made one revolution, a vibrating plate 21 is moved up and down by a stroke equivalent to two times of an eccentric amount and a brush 23 repeats a contact and a noncontact to a dam part of a package 35. Moreover, after the frame 12 is conveyed on a bottom force 28 of a lead molding equipment 16, a lead molded item is formed by making a top force 27 drive. After that, the lead molded item is excluded in a housing tube 7 located outside of a molding press by an excluding cylinder 6. In such a way, a semiconductor device can be manufactured.