Title:
LEAD OUT ELECTRODE
Document Type and Number:
Japanese Patent JPS5772353
Kind Code:
A
Abstract:
PURPOSE:To simplify a structure of fitting a gold bump as well as to improve its strength and integrality of a device by building a gold bump on a protective layer via an adhesion metal and barrier metal in turn. CONSTITUTION:A wiring layer 11 which is composed of a wiring area 11a made o aluminium and an insating area 11b made of aluminium oxide is formed on a substrate 10. A protective layer 12 is deposited on the surface of the wiring layer 11, and a contact hole 13 is etched away in this protective layer 12. An adhesion metal 14 is formed on the exposed surfaces of protective layer 12 and wiring area 11a, and barrier metal 15 is formed on this adhesion metal 14. Then, a resist layer 18 is built on the barrier metal 15 to make a contact hole 18a. Subsequently, a gold bump is built by gold plating, and then the resist layer is etched away to form a lead out electrode so that barrier metal 15 and adhesion metal 14 are remained.
Inventors:
SATOU KAZUO
Application Number:
JP14869880A
Publication Date:
May 06, 1982
Filing Date:
October 23, 1980
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
H01L21/60; H01L23/485; (IPC1-7): H01L21/92