Title:
LEAD PIN FOR HYBRID INTEGRATED CIRCUIT
Document Type and Number:
Japanese Patent JPS5810848
Kind Code:
A
Abstract:
PURPOSE: To improve the moistening property of solder by forming the nose section of the lead pin in tapered form, positively contacting the nose section with one part of the inner circumference of a substrate hole and vertically erecting the lead.
CONSTITUTION: A thick film conductor 12 is shaped onto a substrate 11, solder paste 13 is printed onto the conductor, and the pin, the nose section 14 thereof is formed taperlingly, is erected vertically into the hole bored to the substrate by the collar section 15 and a tapered section. Accordingly, a process supporting the lead can be omitted, and soldering is improved.
Inventors:
YAMANAKA HARUO
SONE SADAYUKI
SUGIOKA SHIYUUJI
SONE SADAYUKI
SUGIOKA SHIYUUJI
Application Number:
JP10972481A
Publication Date:
January 21, 1983
Filing Date:
July 14, 1981
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
H01L23/50; H05K3/30; H05K3/34; (IPC1-7): H01L23/48
Attorney, Agent or Firm:
Takehiko Suzue