Title:
LEAD PIN FOR INTEGRATED CIRCUIT DEVICE
Document Type and Number:
Japanese Patent JPS5823466
Kind Code:
A
Abstract:
PURPOSE: To remove oxygen in silver solder, to prevent the generation of a void and to ensure solder by joining the silver solder to one end section of the lead pin in melted form.
CONSTITUTION: A graphite board 7 with through-holes 6 is stacked onto a graphite board 5, the silver solder 2 consisting of a 72% silver-28% copper alloy and the lead pins 1 composed of an iron-nickel alloy are entered into the through-holes 6, the silver 2 is melted in an oven having a reducing atmosphere, the lead pins 1 and the silver solder 2 are joined and the lead pins 1' are formed.
Inventors:
TAKARASAWA KATSUYUKI
Application Number:
JP12204781A
Publication Date:
February 12, 1983
Filing Date:
August 04, 1981
Export Citation:
Assignee:
TANAKA PRECIOUS METAL IND
International Classes:
H01L23/50; H01L21/48; (IPC1-7): H01L23/48
Domestic Patent References:
| JP52126754B | ||||
| JP55096661B | ||||
| JPS5179265A | 1976-07-10 |