Title:
LEAD PROCESSING DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURED BY USING THE SAME
Document Type and Number:
Japanese Patent JP2018093103
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a lead processing device capable of removing a tie-bar, when manufacturing a resin-sealed semiconductor device projecting an external terminal from the upper surface of the sealing resin body, and to provide a semiconductor device manufactured by applying the same.SOLUTION: In a lead processing device 1, a semiconductor device 51 is placed so that an external terminal 61 projects upward, while directing the surface 57a of the sealing resin body 57 upward. A die plate 5 is inserted between one external terminal 61 and the other external terminal 61. A stripper 7 is placed to face the die plate 5. Under that state, a tie-bar 69, and the like, are cut by moving a punch 41 toward the die plate 5, in a direction crossing the projection direction of the external terminal 61. An insertion hole 5a for inserting the punch 41 is formed in the die plate 5.SELECTED DRAWING: Figure 16
Inventors:
UEDA TETSUYA
MATAGA SHINJI
SAKAMOTO TAKESHI
MATAGA SHINJI
SAKAMOTO TAKESHI
Application Number:
JP2016236565A
Publication Date:
June 14, 2018
Filing Date:
December 06, 2016
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/50; B21D28/00; B21D28/02; B21D28/24; B21D28/34; B21D37/08; B21D45/00; B26D1/09; H01L21/56
Attorney, Agent or Firm:
Fukami patent office