LEAD SHAPE IN SEMICONDUCTOR PACKAGE - MITSUBISHI ELECTRIC CORP

Title:

LEAD SHAPE IN SEMICONDUCTOR PACKAGE

Document Type and Number:

Japanese Patent JPH0563132

Kind Code:

A

Abstract:

PURPOSE: To prevent a lead from deviating aside or falling into a pad when a led is made to contact with and to press against a pad at the time of surface- mounting a semiconductor package on a circuit substrate.

CONSTITUTION: A part of a lead 2 extended from the side of a semiconductor package 1 while coming in contact with a pad 3 is shaped in an arch or bent at an angle.

Inventors:

SASAKI HIROSHI
OI NORIO
TAO KOICHI

Application Number:

JP22277091A

Publication Date:

March 12, 1993

Filing Date:

September 03, 1991

Export Citation:

Click for automatic bibliography generation Help

Assignee:

MITSUBISHI ELECTRIC CORP

International Classes:

H01L23/50; H05K3/34; (IPC1-7): H01L23/50

Attorney, Agent or Firm:

Mamoru Takada (1 person outside)

Next Patent: RESIN SEALING TYPE SEMICONDUCTOR DEVICE