PURPOSE: To provide the lead-wire connecting method, of an electronic component, wherein, even when the pitch between lead wires is narrow, there is no danger that the lead wires are short-circuited due to the excess of a solder and that a connection defect is caused due to the shortage of the solder and, even when the height of the individual lead wires is irregular, the lead wires can surely be soldered.

CONSTITUTION: The lead-wire connecting method, of an electronic component, wherein a lead wire 300 for an electronic component 100 is connected to an electrode 210 formed on a circuit board 200 is provided with the following: a process to supply a solder 400 in proper quantities to the electrode 210 on the circuit board 200 by means of a capillary; a process to face the lead wire 300 for the electronic component 100 with the electrode 210; and a process to compression-bond the lead wire 300 to the electrode 210 by means of a heating tool.