Title:
LEADLESS HYBRID INTEGRATED CIRCUIT
Document Type and Number:
Japanese Patent JPH04352458
Kind Code:
A
Abstract:
PURPOSE: To mount a ceramic chip carrier type leadless hybrid integrated circuit having a through hole side electrode on a mother board using a resin base material by solder connecting.
CONSTITUTION: Four corners of a lower surface electrode to be connected to a mother board of a leadless hybrid integrated circuit are formed larger than the other electrodes, and further a pair of corner through hole side electrodes 5 are provided at the four corners through the corners.
Inventors:
OTSUKI KAZUHIKO
MEGURO TAKESHI
MEGURO TAKESHI
Application Number:
JP12716591A
Publication Date:
December 07, 1992
Filing Date:
May 30, 1991
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L23/12; H05K1/18; H05K1/14; H05K3/34; H05K3/36; (IPC1-7): H01L23/12; H05K1/18
Attorney, Agent or Firm:
Akira Kobiji (2 outside)