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Patent Searching and Data


Title:
LEAF PUTTING METHOD
Document Type and Number:
Japanese Patent JP2015136937
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a leaf putting method that enables an image of a gold leaf and a printed leaf to be easily, reliably and inexpensively leaf-put and transferred to various kinds of materials.SOLUTION: A seal, in which a silicon rubber plate 2 is joined to a tip end surface of a block 3, is prepared. The silicon rubber plate 2 is brought into pressure contact with a heated hot plate 5 and heated. The silicon rubber plate 2 is contact-bonded from an upper part of a transfer leaf superposed on a material to be transferred. The leaf is transferred to the material to be transferred.

Inventors:
SUEMATSU ICHIRO
Application Number:
JP2014020745A
Publication Date:
July 30, 2015
Filing Date:
January 20, 2014
Export Citation:
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Assignee:
SUEMATSU ICHIRO
International Classes:
B44C1/17; B41F16/00; B41K1/02; B41M3/12
Domestic Patent References:
JPS61262200A1986-11-20
JPS5811189A1983-01-21
Attorney, Agent or Firm:
Nobuyoshi Tahara