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Title:
LEAF SPRING FOR CAMERA MODULE DRIVE MECHANISM AND MANUFACTURING METHOD FOR THE SAME
Document Type and Number:
Japanese Patent JP2014062975
Kind Code:
A
Abstract:

To provide a leaf spring for a camera module drive mechanism, which enables use of solder with better wettability.

A method of manufacturing a leaf spring with electrical connection terminals for a camera module drive mechanism includes the steps of: preparing a leaf spring material 40; etching and half-etching the leaf spring material 40 using resist 41; and removing the resist 41 from the leaf spring material 40. An external shape of the leaf spring material 40 is formed through the etching process and connection terminals 11d, 11e are formed through the half-etching process.


Inventors:
UENO YOSHIMASA
IKENAGA CHIKAO
Application Number:
JP2012207111A
Publication Date:
April 10, 2014
Filing Date:
September 20, 2012
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
G02B7/00; G02B7/04; G03B17/02; H04N5/225
Domestic Patent References:
JP2010286532A2010-12-24
JPH09205698A1997-08-05
JPH0998498A1997-04-08
JP2010168666A2010-08-05
JP2003329734A2003-11-19
JP2010128443A2010-06-10
JP2011076895A2011-04-14
JP2012137544A2012-07-19
JP2008122470A2008-05-29
JP2010286532A2010-12-24
JPH09205698A1997-08-05
JPH0998498A1997-04-08
JP2010168666A2010-08-05
JP2003329734A2003-11-19
JP2010128443A2010-06-10
JP2011076895A2011-04-14
JP2012137544A2012-07-19
JP2008122470A2008-05-29
Attorney, Agent or Firm:
Hirohito Katsunuma
Hiroyuki Nagai
Katsuomi Isogai
Yukihiro Hotta