Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3119104
Kind Code:
B2
Abstract:
PURPOSE: To obtain the subject composition, capable of providing a cured product of high quality excellent in curing characteristics in molding and low moisture permeability and suitable as a material for premolded type hollow packages by adding an inorganic water absorbent in a state of removed adsorption moisture by carrying out the regeneration treatment.
CONSTITUTION: This epoxy resin composition is obtained by blending an inorganic filler in an amount of ≥200 pts.wt. based on 100 pts.wt. total amount of an epoxy resin and a curing agent and further adding an inorganic water absorbent, prepared by treating spherical porous silica having 0.5-1.0g/cm3 apparent specific gravity, 10-50ml/100g volume of oil absorption, 10-100m2/g specific surface area, 0.10-1.0ml/g pore volume and 0.5-10μm average particle diameter at ≥200°C temperature for ≥5hr and thereby reducing the content of absorption moisture to <0.1wt.% in an amount of ≥10 pts.wt. based on 100 pts.wt. total amount of the epoxy resin and the curing agent in the epoxy resin composition consisting essentially of the epoxy resin, curing agent and inorganic filler.
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Inventors:
Kazuhiro Arai
Toshio Shiobara
Taharu Ikeda
Toshio Shiobara
Taharu Ikeda
Application Number:
JP33172894A
Publication Date:
December 18, 2000
Filing Date:
December 09, 1994
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C09K9/00; C08K3/00; C08K3/36; C08L63/00; (IPC1-7): C08L63/00; C08K3/00; C08K3/36
Domestic Patent References:
| JP36279A | ||||
| JP2219814A | ||||
| JP431311A | ||||
| JP649333A | ||||
| JP2173033A | ||||
| JP232115A | ||||
| JP1275626A | ||||
| JP1242615A |
Attorney, Agent or Firm:
Takashi Kojima