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Title:
LED ARRAY MODULE
Document Type and Number:
Japanese Patent JPH01110784
Kind Code:
A
Abstract:
PURPOSE:To enable the reduction in cost and the miniaturization of an LED array module as a whole without making an LED array larger in size and the irregularity in brightness by a method wherein an individual electrode and a common electrode of each light emitting element are provided to a light emitting face side and a non-light emitting face side respectively apart from each other, and so forth. CONSTITUTION:A plurality of monolithic type LED array chips 24 provided with two or more light emitting elements 26 are provided, and an LED array module is composed of a plurality of LED array chips 24 disposed in a row on a substrate 21, where an individual electrode 27 connected with one input terminal of each light emitting element 26 respectively and a common electrode 28 connected with the other input terminal of each light emitting element 26 respectively are formed on a light emitting face side and a non-light emitting face of the LED array chip 24 respectively apart from each other. And, the above individual electrode 27 is directly connected with an individual wiring pattern 22 formed on the substrate 21 side, and the common electrode 28 is connected with a common wiring pattern 23 formed on the substrate 21 through a conductive component 30. In this process, for instance, the individual electrodes 27 are provided on the both sides of the row of the light emitting elements 26 being alternately disposed.

Inventors:
ANDO KOHEI
SEKINE AKIRA
Application Number:
JP26907887A
Publication Date:
April 27, 1989
Filing Date:
October 23, 1987
Export Citation:
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Assignee:
SUNX LTD
International Classes:
H01L33/08; H01L33/62; (IPC1-7): H01L33/00
Domestic Patent References:
JPS63318172A1988-12-27
JPS6384352A1988-04-14
JPS6012782A1985-01-23
JPS5598879A1980-07-28
Attorney, Agent or Firm:
Tsuyoshi Sato



 
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