Title:
LED BULB
Document Type and Number:
Japanese Patent JP2012113938
Kind Code:
A
Abstract:
To provide an LED bulb capable of promoting heat dissipation from LED chips.
The LED bulb includes a plurality of LED chips 201, an LED substrate 300 having a mounting face 301 for supporting the plurality of LED chips 201, and a heat transfer bracket 400 with the LED substrate 300 attached. The heat transfer bracket 400 has a heat dissipation through-hole 422 formed in a region where the LED substrate 300 is not attached.
Inventors:
IGAKI MASARU
Application Number:
JP2010261289A
Publication Date:
June 14, 2012
Filing Date:
November 24, 2010
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
F21S2/00; F21V29/00; H01L33/64; F21Y101/02
Attorney, Agent or Firm:
Minoru Yoshida
Tatsuya Tanaka
Tsukasa Senba
Yasumitsu Suzuki
Nao Usui
Tatsuya Tanaka
Tsukasa Senba
Yasumitsu Suzuki
Nao Usui