Title:
LED LAMP
Document Type and Number:
Japanese Patent JP2009283832
Kind Code:
A
Abstract:
To provide an LED lamp having a structure which dissipates heat more.
The LED lamp A1 comprises a substrate 10, a first metal wiring layer 11 formed on a surface of the substrate 10, a second metal wiring layer 12 formed on the surface of the substrate 10 apart from the first metal wiring layer 11, and a light emitting diode 31 die-bonded to a lead 32 fixed to the first metal wiring layer 11, has a first protective layer 21 covering the first metal wiring layer 11 and a second protective layer 22 covering the second wiring layer 12, the first protective layer 21 being formed of solder.
Inventors:
FUKUI HIROYUKI
Application Number:
JP2008136628A
Publication Date:
December 03, 2009
Filing Date:
May 26, 2008
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
F21S2/00; F21S8/04; F21V19/00; F21V29/00; H01L23/373; H01L33/48; H01L33/56; H01L33/62; H01L33/64; F21Y101/02
Domestic Patent References:
| JP2005072206A | 2005-03-17 | |||
| JP3830726B2 | 2006-10-11 | |||
| JPH10247749A | 1998-09-14 |
Foreign References:
| WO2007037339A1 | 2007-04-05 |
Attorney, Agent or Firm:
Minoru Yoshida
Tatsuya Tanaka
Tsukasa Senba
Hiroshi Furusawa
Yasumitsu Suzuki
Nao Usui
Tatsuya Tanaka
Tsukasa Senba
Hiroshi Furusawa
Yasumitsu Suzuki
Nao Usui
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