Title:
LED LIGHT SOURCE ASSEMBLY WITH HEAT SINK AND HEAT CONDUCTIVE GLASS COVER
Document Type and Number:
Japanese Patent JP2015062188
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an LED assembly with significantly improved heat dissipation and enhanced thermal junction performance, which comprises: an LED light source positioned between a heat sink and a heat conductive glass element; and at least one hold-down element.SOLUTION: A hold-down element 150 of an LED assembly provides compressive force to hold a heat conductive glass element 140 against an LED light source 120, thereby pressing the LED light source 120 against a heat sink reflector 130. A 1/8 inch glass element with a surface area of five times the LED diffuser surface area is held over the LED light source 120 by one or more spring wires 152 inserted through holes in the heat sink.
Inventors:
KLAUS BOLLMANN
TOM PENICK
TOM PENICK
Application Number:
JP2014222455A
Publication Date:
April 02, 2015
Filing Date:
October 31, 2014
Export Citation:
Assignee:
RINGDALE INC
International Classes:
F21V29/00; F21V19/00; H01L33/64
Domestic Patent References:
| JP2006324199A | 2006-11-30 | |||
| JP2007134472A | 2007-05-31 | |||
| JP2008518461A | 2008-05-29 | |||
| JP2008225365A | 2008-09-25 |
Attorney, Agent or Firm:
Suzuki Isobe