Title:
LED MODULE AND LED LAMP USING THE SAME
Document Type and Number:
Japanese Patent JP2020107693
Kind Code:
A
Abstract:
To provide an LED module that suppresses the occurrence of solder cracks and can withstand relatively long-term use.SOLUTION: An LED module used for an LED lamp includes a printed circuit board and an LED element mounted on the printed circuit board by soldering, the ratio of the area of the printed circuit board to the area of the LED element (board/LED) is within the range of the following formula (1). 19≤(board/LED)≤58 (1). The thermal load per solder connection area of the printed circuit board and the LED element is within the range of the following formula (2). The thermal load per solder connection area≤0.44[W/mm2] (2).SELECTED DRAWING: Figure 2
Inventors:
MATSUMOTO YASUHISA
Application Number:
JP2018244123A
Publication Date:
July 09, 2020
Filing Date:
December 27, 2018
Export Citation:
Assignee:
IWASAKI ELECTRIC CO LTD
International Classes:
F21K9/00; H05K1/18; F21K9/232; F21K9/238; F21V19/00; H01L33/62
Attorney, Agent or Firm:
Takahashi Kaname
Tsuyoshi Oshio
Tsuyoshi Oshio