To provide an LED module capable of enhancing heat radiation performance by eliminating heat conduction loss and having the optimal heat radiation design matched to respective heat resistant temperatures of LED chips and control elements.

In an LED module 10 including a socket housing 12 being detachably mounted to a reflector 8 of a vehicular lamp 1, a heat sink (heat radiation member) 13 assembled in the socket housing 12, and LED chips 14, 15 as a light source, the LED chips 14, 15 are directly mounted on the heat sink 13. Further, the center axis of the socket housing 12 is set up to be coincided with an optical axis, and the plurality of LED chips 14, 15 are arranged in a rotational symmetry with respect to the center axis. Furthermore, a circuit board 21 having control elements 22 for controlling driving current to the LED chips 14 is assembled to the socket housing 12 in a state in contact with the heat sink 13.