Title:
レンズモジュールの実装方法及びその構造
Document Type and Number:
Japanese Patent JP4567386
Kind Code:
B2
Abstract:
A lens module has a module body and a mating receptacle. The module body has a lens unit and an image sensing and processing unit, the image sensing and processing unit receiving light beams from the lens unit and producing an image signal. The mating receptacle is made of insulating material, which is detachably engaged with the module body and has conductive terminals formed therein for transmitting the image signal. An assembling method of the lens module includes the following steps. First, the mating receptacle is installed on a printed circuit board of an electronic device by a surface mounting technology. Second, the module body is installed in the mating receptacle to implement electrical interconnection between the module body and the printed circuit board.
Inventors:
Dragon building
Application Number:
JP2004192856A
Publication Date:
October 20, 2010
Filing Date:
June 30, 2004
Export Citation:
Assignee:
HON HAI PRECISION INDUSTRY CO.,LTD.
International Classes:
H04N5/225; G02B6/36; G02B7/02; H01J40/14; H01L21/58; H01L21/60; H01L23/22; H01L23/48; H01L27/00; H01L27/146; H01L31/0232; H04N1/04; H04N5/335; H05K
Domestic Patent References:
| JP5259424A | ||||
| JP2004112203A | ||||
| JP2001188155A | ||||
| JP10233946A | ||||
| JP2005073166A | ||||
| JP2005101778A | ||||
| JP2005176185A |
Attorney, Agent or Firm:
Yasuhiko Murayama
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro