Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
LENS MODULE PACKAGING METHOD, AND STRUCTURE THEREOF
Document Type and Number:
Japanese Patent JP2005312002
Kind Code:
A
Abstract:

To provide a matching receptacle improving yield of an assembled article or having high reliability suited for mass-production in a lens module packaging method and its structure.

A module body has a lens unit, an image sensing and processing unit, and an electric signal terminal set. The matching receptacle has an electric signal terminal set abutted with the module body. A lens module packaging method includes: (1) first electrically connecting the matching receptacle onto a circuit board of an electronic device by a surface mounting technology; and (2) further engaging or connecting the module body onto the matching receptacle. Thus, light beams enters the image sensing and processing unit via the lens unit, an image signal is produced and furthermore, the image signal is transmitted onto the circuit board of the electronic device via the terminal set of the matching receptacle.


Inventors:
Lung, Chien-lih
Application Number:
JP2004000192856
Publication Date:
November 04, 2005
Filing Date:
June 30, 2004
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
PREMIER IMAGE TECHNOLOGY CORP
International Classes:
G02B6/36; G02B7/02; H01J40/14; H01L21/58; H01L21/60; H01L23/22; H01L23/48; H01L27/00; H01L27/146; H01L31/0232; H04N1/04; H04N5/225; H04N5/335; H05K; (IPC1-7): H04N5/225; H04N5/335
Attorney, Agent or Firm:
西川 惠清
森 厚夫