Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
LEVEL WOUND COIL PACKAGING METHOD
Document Type and Number:
Japanese Patent JPH0929333
Kind Code:
A
Abstract:

To provide a level wound coil packaging method which does not give flaw and deformation to a level wound coil and does not generate drawing and collapse of the coil inner layer at the time of uncoiling.

A level wound coil 18 is placed on a collar plate 16 through a doughnut shape buffer material 17, next, an elastic plate, which is folded to a cylindrical shape and formed to a half split barrel body 12 expandable/ reducible, is inserted into the inside of the level wound coil 18, next, the collar plate 11 is placed on the upper face of the level wound coil 18 through the doughnut shape buffer material 15, next, the upper/lower collar plates 11, 16 are fastened with a steel band 14.


Inventors:
NISHIKAWA YUJI
TAKAHASHI NOBUO
Application Number:
JP18267895A
Publication Date:
February 04, 1997
Filing Date:
July 19, 1995
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
B65B27/06; B21C47/24; B21C47/26; B65H75/22; (IPC1-7): B21C47/24; B21C47/26; B65B27/06