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Title:
LID MATERIAL
Document Type and Number:
Japanese Patent JP2022113217
Kind Code:
A
Abstract:
To provide a lid material capable of appropriately performing steam passing even when heating by a microwave oven with various output power.SOLUTION: A lid material (100) comprises a sealant layer (104) and a heating ink layer (102) on the sealant layer (104). The heating ink layer (102) includes conductive carbon. Dielectric loss of the heating ink layer (102) is 350 or more. A transmission density of the heating ink layer (102) of the lid material (100) is 1.2 or more and 2.8 or less.SELECTED DRAWING: Figure 2

Inventors:
FUSHIDA SEIYA
Application Number:
JP2021009286A
Publication Date:
August 04, 2022
Filing Date:
January 25, 2021
Export Citation:
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Assignee:
FUJI SEAL INC
International Classes:
B65D81/34; A47J27/00; A47J36/04; B32B27/00; B65D51/16; B65D53/04; B65D65/40; B65D77/20
Attorney, Agent or Firm:
Patent Attorney Fukami Patent Office



 
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