PURPOSE: To lessen the thermal influence on the circumferential part of parts to be soldered by providing the route for transporting works to be soldered through the inside of a tunnel furnace for preheating and forming a part of this tunnel furnace of a light projecting plate for incidence of light beams.
CONSTITUTION: This light beam soldering device irradiates the work 33 to be soldered with the light beams 36 and solders the work by the heat thereof. The route for transporting the work 33 is provided through the inside of the tunnel furnace 31 for preheating and a part of this tunnel furnace is formed of the light projecting plate 35 for incidence of the light beams. The work 33 is preheated during the transportation in the tunnel furnace 31. The normal heating of the work 33 is executed by the light beams 36 irradiated into the tunnel furnace 31 through the light projecting plate 35 of this tunnel furnace. The thermal influence on the circumferential parts of the parts to be soldered is lessened in this way and the inline constitution of the local soldering devices is possible with this soldering device.
TAKAHASHI TAKAO
OKANO TERUO
ONOZAKI JUNICHI
KOBAYASHI NOBUTAKA
