Title:
LIGHT-CURABLE PASTE AND CURED PRODUCT OF THE SAME
Document Type and Number:
Japanese Patent JP2011037986
Kind Code:
A
Abstract:
To provide an insulating light-curable paste which is usable to manufacture the resin insulating layer or the like for a semiconductor, a package substrate, or a surface mount LED, and is excellent in heat resistance and heat releasing; and a cured product of the same.
The light-curable paste includes at least one compound of an epoxy acrylate compound and an epoxy methacrylate compound having a plurality of ethylenic unsaturated groups in one molecule, a photopolymerization initiator, a photopolymerizing monomer, and an insulating inorganic particle, wherein the insulating inorganic particle is incorporated at a rate of 600-2,000 pts.mass based on 100 pts.mass of the total weight of the compound and the photopolymerizing monomer.
Inventors:
DAIKO YOSHIKAZU
NICHIMA YUKITOMO
USHIKI SHIGERU
NICHIMA YUKITOMO
USHIKI SHIGERU
Application Number:
JP2009186663A
Publication Date:
February 24, 2011
Filing Date:
August 11, 2009
Export Citation:
Assignee:
TAIYO HOLDINGS CO LTD
International Classes:
C08F290/00; C08F2/44; C08F2/48
Domestic Patent References:
| JP2003192885A | 2003-07-09 | |||
| JP2007049064A | 2007-02-22 | |||
| JP2007254688A | 2007-10-04 |
Previous Patent: NBR COMPOSITION AND OIL SEAL FOR RECIPROCATING MOTION USING THE SAME
Next Patent: SOFT POLYURETHANE FOAM
Next Patent: SOFT POLYURETHANE FOAM