Title:
発光装置、表示装置、および固体発光素子基板
Document Type and Number:
Japanese Patent JP5097127
Kind Code:
B2
Abstract:
There is provided a light emitting device and the like that achieve efficient heat radiation while production cost is reduced. The backlight device includes a backlight frame, and LED substrates that each have plural LEDs and that are mounted on the backlight frame with mounting screws. In each LED substrate, heat transmission based circuits 300 are formed. The heat transmission based circuit 300 extends from heat transmission lands 310 where the respective LEDs are mounted, via through holes 340 and heat transmission circuits 320, to a contact heat transmission land 330 where the LED substrate is fixed to the backlight frame with the mounting screw.
Inventors:
Shuji Gomi
Application Number:
JP2008551036A
Publication Date:
December 12, 2012
Filing Date:
December 17, 2007
Export Citation:
Assignee:
SHOWA DENKO K.K.
International Classes:
H01L33/64; F21S2/00; F21V19/00; F21V29/00; G02F1/1333; G02F1/13357; F21Y101/02
Domestic Patent References:
| JP2006080117A | 2006-03-23 | |||
| JP2002094122A | 2002-03-29 | |||
| JP2005136224A | 2005-05-26 | |||
| JP2002040955A | 2002-02-08 | |||
| JP2006059607A | 2006-03-02 |
Attorney, Agent or Firm:
Jiro Kobe
Yukio Iyoda
Yukio Iyoda