To enable high service durability of a diode and to realize coloring of an arbitrary color by preventing peeling derived from the difference of thermal expansion coefficients in a diode chip, a lead electrode, a conductive wire and a transparent sealing resin, and the operating malfunction of the diode in a light emission device.

The light emitting device consists of a diode chip formed of a light emitting diode (LED) or a laser diode, a conductive wire connecting the lead electrode and the electrode of the diode chip, a binder layer coating the diode chip, and a transparent layer coating the diode chip and the conductive wire on the binder layer. The binder layer is a transparent polyimide silicone resin containing an additive which changes the color tone.