Title:
発光装置及びその製造方法、並びにパッケージの製造方法
Document Type and Number:
Japanese Patent JP6717079
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a light-emitting device, which has an excellent mounting precision.SOLUTION: A manufacturing method of a light-emitting device comprises: a package including first and second leads having a first surface 20a and a second surface 20b opposite to the first surface, and a resin molding body that includes an opening part in the front surface and embeds a part of the first and second leads; and a light-emitting element mounted in the opening part. The first and second leads include: an outer lead part extended from a lower surface 30c of the resin molding body; and an inner lead part that is embedded in the resin molding body, and in which a part of the first surface is exposed in the opening part. In the manufacturing method of the light-emitting device, the lower surface side of the resin molding body is set as a mounting surface, and a step of folding the outer lead part so that the second surface of each of two outer lead parts is opposite to the lower surface of the resin molding body is comprised. In each of the outer lead parts, a concave part is formed in the second surface before the folding step, and in the folding step, each of the outer lead parts is folded in the concave part, thereby forming the first surface as the mounting surface.SELECTED DRAWING: Figure 3
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Inventors:
Takeshi Morikawa
Application Number:
JP2016128815A
Publication Date:
July 01, 2020
Filing Date:
June 29, 2016
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01L33/62; H01L33/48
Domestic Patent References:
| JP2015520518A | ||||
| JP61051862A | ||||
| JP2014192292A | ||||
| JP2006041137A | ||||
| JP2006203052A | ||||
| JP2000294711A | ||||
| JP60254646A |
Foreign References:
| US20100163918 |