To provide a light-emitting device which can prevent a contact failure between a lower electrode pad portion covered by an insulating layer and a flexible printed circuit (FPC) and a damage of the lower electrode pad portion in subsequent processes, and to provide a manufacturing method of the light-emitting device.

The manufacturing method of a light emitting device includes a step in which a first electrode provided with an effective portion alongside one direction of a substrate and a main pad portion is formed on a substrate, a step in which, while exposing at least a part of the main pad portion, an insulating layer is formed on the substrate, a step in which a second electrode layer is formed over a whole of the substrate and a step in which the second electrode layer gets a patterning and the effective portion and the pad portion of the second electrode crossing with the first electrode are formed and on the main pad portion there is formed an auxiliary pad portion contacting with the main pad portion.