発光素子の製造プロセス及び発光素子 - NAJING TECHNOLOGY CORPORATION LIMITED

Title:

発光素子の製造プロセス及び発光素子

Document Type and Number:

Japanese Patent JP7218950

Kind Code:

B2

Abstract:

This present disclosure provides a manufacturing process of light emitting device and a light emitting device. The manufacturing process of light emitting device includes: step S1, making a quantum dot film; step S2, providing a LED unit, the LED unit including at least one LED chip; step S3, disposing a first transparent adhesive layer on an exposed surface of each LED chip; step S4, disposing the quantum dot film on the surface of the first transparent adhesive layer far away from the LED chip.

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Inventors:

Kang Young-in
Do Xiangpong
Wan Hailing
Zhou Jianha
Lan Yun Jian

Application Number:

JP2020570557A

Publication Date:

February 07, 2023

Filing Date:

September 20, 2019

Export Citation:

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Assignee:

NAJING TECHNOLOGY CORPORATION LIMITED

International Classes:

H01L33/50; B32B9/00; G02B5/20

Domestic Patent References:

JP2017136737A

Foreign References:

WO2015141226A1
WO2017221777A1
US20120182714
CN106449908A
WO2012132232A1
WO2016194344A1
CN207021289U

Attorney, Agent or Firm:

Patent Attorney Tsutsui International Patent Office

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