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Title:
LIGHT-EMITTING DEVICE, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2003109773
Kind Code:
A
Abstract:

To provide a semiconductor device enabling to reduce degradation by permeating moisture or transmitting oxygen, for example, a light-emitting device having an OLED formed on a plastic board, or a liquid crystal display device using a plastic board.

After a peel-off layer containing an element is formed on a board, the peel-off layer is adhered to a support body and the peel-off layer is peeled off from the board, a thin film in contact with the peel-off layer is formed, and then, is bonded to a transfer body 22. In so doing, a crack generated at peeling is repaired, and by using a film 20 having heat conductance as a thin film contacting the peel-off layer, in particular, a nitride of aluminum or oxide nitride of aluminum, heat generation of the element is diffused, which has the effect of protecting the transfer body 22, in particular, the plastic board from deformation or deterioration.


Inventors:
YAMAZAKI SHUNPEI
TAKAYAMA TORU
MARUYAMA JUNYA
MIZUKAMI MAYUMI
Application Number:
JP2001300021A
Publication Date:
April 11, 2003
Filing Date:
September 28, 2001
Export Citation:
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Assignee:
SEMICONDUCTOR ENERGY LAB
International Classes:
H05B33/22; G09F9/30; G09F9/35; H01L21/02; H01L21/336; H01L27/12; H01L27/32; H01L29/786; H01L51/50; H01L51/52; G02F1/1333; H01L21/314; H01L21/316; H01L21/318; H01L51/40; (IPC1-7): H05B33/22; G09F9/30; G09F9/35; H01L21/02; H01L21/336; H01L27/12; H01L29/786; H05B33/14
Domestic Patent References:
JPH06296023A1994-10-21
JP2001060697A2001-03-06
JP2001068678A2001-03-16
JP2001189460A2001-07-10



 
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