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Title:
LIGHT-EMITTING DEVICE
Document Type and Number:
Japanese Patent JP2017130633
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To suppress deterioration in heat dissipation of a light-emitting device.SOLUTION: The light-emitting device comprises a substrate 10, a light-emitting element 11 mounted on the substrate 10, a sealing resin 12 for sealing the light-emitting element 11, a rear surface electrode 13 provided on a rear surface of the substrate 10 and electrically connected to the light-emitting element 11, and a heatsink 14 provided on the rear surface of the substrate 10. The heatsink 14 is provided in a region except the region in which the rear surface electrode 13 is provided separated from the rear surface electrode 13. The heatsink 14 is divided into 18 small heatsinks 16 by grooves 15 having a rectangular lattice-like pattern. When the light-emitting device is mounted on a mounting substrate, the gas generated from a solder is efficiently emitted to the outside through the grooves 15, thereby suppressing the air bubbles between the heatsink 14 and the solder.SELECTED DRAWING: Figure 2

Inventors:
MIWA TOMOHIRO
SHIMONISHI SHOTA
KATO DAISUKE
Application Number:
JP2016011061A
Publication Date:
July 27, 2017
Filing Date:
January 22, 2016
Export Citation:
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Assignee:
TOYODA GOSEI KK
International Classes:
H01L33/64; F21S2/00; F21V29/503; F21V29/70; H01L23/12; H01L23/13; H01L23/36; H05K1/02
Domestic Patent References:
JP2011040714A2011-02-24
JP2003100965A2003-04-04
JP2006245436A2006-09-14
JP2013229490A2013-11-07
JPS61177762A1986-08-09
JP2009004129A2009-01-08
JP2003092011A2003-03-28
JP2012084733A2012-04-26
JP2009026765A2009-02-05
JP2013149695A2013-08-01
Foreign References:
US20090129025A12009-05-21
Attorney, Agent or Firm:
Osamu Fujitani
Akinori Isshiki



 
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