OPTICAL FIBER ARRAY MODULE FORMED BY USING SOLDERING AND ITS PRODUCTION

Japanese Patent JP3126344

B2

PROBLEM TO BE SOLVED: To make it possible to produce an inexpensive connection module and to align optical fibers by self-alignment using the surface tension of solder with good accuracy.
SOLUTION: This process has a process for forming holes 160 to be inserted with optical fibers at prescribed intervals on a silicon wafer or ceramic substrate 150, a process for forming a metallic layer over the entire surface of these holes 160 and the substrate 150, a process for plating a solder alloy material over the entire surface of the holes 160 and the substrate 150, a process for inserting the optical fibers deposited with metal by evaporation into the holes 160 of the substrate 150 plated with the solder alloy material, a process for positioning the optical fibers into the central parts of the holes 160 by the surface tension that the solder alloy material possesses by heating the resulted object, a process for fixing the optical fibers inserted into the holes 160 of the substrate 150 and the substrate 150 by injecting epoxy to be cured by heat or UV rays in order to constitute an optical fiber array module precisely adherable to an optical waveguide element and a process for polishing the section of the optical fiber module inserted into the holes 160 of the substrate 150 so as to have optical illuminance.

JPH05503165	[Title of Invention] Card Cage
WO/2018/047099	MODULAR FIBER FRAME
JPS6124188	REINFORCING INDUCTION HEATER OF OPTICAL FIBER CONNECTOR

Yu Zhang
Yu Yu
Lee
Lee Tae-hyung

JP22787398A

January 22, 2001

August 12, 1998

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Samsung Electronics Co.,Ltd.

G02B6/24; G02B6/30; G02B6/34; G02B6/36; G02B6/38; (IPC1-7): G02B6/30; G02B6/36

JP63144310A
JP63163413A
JP735958A
JP60500098A

Hidekazu Miyoshi (1 outside)

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