Title:
発光装置
Document Type and Number:
Japanese Patent JP5521026
Kind Code:
B2
Abstract:
To provide a semiconductor device in which a layer to be peeled is attached to a base having a curved surface, and a method of manufacturing the same, and more particularly, a display having a curved surface, and more specifically a light-emitting device having a light emitting element attached to a base with a curved surface. A layer to be peeled, which contains a light emitting element furnished to a substrate using a laminate of a first material layer which is a metallic layer or nitride layer, and a second material layer which is an oxide layer, is transferred onto a film, and then the film and the layer to be peeled are curved, to thereby produce a display having a curved surface.
Inventors:
Toru Takayama
Junya Maruyama
Yugo Goto
Hideaki Kuwahara
Shunpei Yamazaki
Junya Maruyama
Yugo Goto
Hideaki Kuwahara
Shunpei Yamazaki
Application Number:
JP2012281298A
Publication Date:
June 11, 2014
Filing Date:
December 25, 2012
Export Citation:
Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
G09F9/30; H01L23/50; B60K35/00; G09F9/00; H01L21/762; H01L27/32
Domestic Patent References:
| JP2001319789A | ||||
| JP2001318624A | ||||
| JP2001185354A | ||||
| JP2001222240A |