Title:
LIGHT-EMITTING DIODE ARRAY AND OPTICAL PRINTHEAD EQUIPPED WITH IT
Document Type and Number:
Japanese Patent JP3806707
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an optical printhead capable of reliably realizing wire bonding and performing high-reliability bonding in a light-emitting diode array of high density of 600 dpi or more.
SOLUTION: The light-emitting diode array where a plurality of light-emitting areas 21 and a separate longitudinal electrode 23 connected with the light-emitting areas 21 though an electrode wire 22 are disposed is characterized in that a protective film 25 is formed on the surface of the wire 22 and the surface of an edge section of the electrode 23 and the protective film on a long-side edge of the electrode 23 is removed.
Inventors:
Shoji Inaba
Application Number:
JP2003306982A
Publication Date:
August 09, 2006
Filing Date:
August 29, 2003
Export Citation:
Assignee:
Sanyo Electric Co., Ltd.
Tottori Sanyo Electric Co.,Ltd.
Tottori Sanyo Electric Co.,Ltd.
International Classes:
B41J2/44; B41J2/45; B41J2/455; H01L33/08; H01L33/38; H01L33/62; (IPC1-7): H01L33/00; B41J2/44; B41J2/45; B41J2/455
Domestic Patent References:
| JP7314772A | ||||
| JP9270535A | ||||
| JP7036754Y2 |
Attorney, Agent or Firm:
Hiroshi Kakutani
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