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Title:
LIGHT-EMITTING DIODE ARRAY
Document Type and Number:
Japanese Patent JP3232152
Kind Code:
B2
Abstract:

PURPOSE: To provide a high-density light-emitting diode array, which could not be realized in the past, by protecting a light-emitting part from chippings, even if the length from the light-emitting part of a light-emitting diode array to the end of a chip is made smaller than the size of a chipping.
CONSTITUTION: In a light-emitting diode array having light-emitting dots arranged in a row, a reverse mesa shape 1-6 is formed relative to the end face of a chip directed vertically to the direction, in which light emitting diodes (1-2, 1-3) are arranged relative to the semiconductor substrate 1-1 of a chip constituting the light-emitting diode array, i.e., relative to the end face of the chip facing an adjacent chip. Thus, the reverse mesa shape is formed in the chip end face so that a light-emitting part can be protected from large chippings even if such chippings are generated at the time of dicing.


Inventors:
Satoru Sugawara
Application Number:
JP2927193A
Publication Date:
November 26, 2001
Filing Date:
February 18, 1993
Export Citation:
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Assignee:
株式会社リコー
リコー応用電子研究所株式会社
International Classes:
B41J2/45; B41J2/455; H01L27/15; H01L33/08; B41J2/44; H01L33/20; H01L33/30; H01L33/40; H01L33/44; (IPC1-7): H01L33/00; B41J2/44; B41J2/45; B41J2/455
Domestic Patent References:
JP210879A
JP523557U
JP62187745U
JP6387859U
Attorney, Agent or Firm:
Toru Kabayama (1 person outside)



 
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