Title:
LIGHT EMITTING DIODE FILAMENT BULB
Document Type and Number:
Japanese Patent JP2020021724
Kind Code:
A
Abstract:
To provide a light emitting diode filament bulb capable of improving the effect of heat dissipation and heat radiation of the light emitting diode filament bulb.SOLUTION: A light emitting diode filament bulb includes a base 10, a filament support 40, a transparent bulb 20 and a light emitting diode filament 30, and the filament support and the base are electrically connected. The filament support includes two metal support wires 41, 42, and the light emitting diode filament includes two electrode pins 31, 32 electrically connected to the two metal support wires respectively and for forming a drive circuit. Out of these, on the surface of the two metal support wires, a coating material including graphene or boron nitride (BN) is coated, and a heat dissipation and black body radiation layer are formed. A substrate of the light emitting diode filament includes a heat radiation heat dissipation film on the back surface, a heat convection of a gas inside the transparent bulb is promoted and heat radiation capacity is enhanced.SELECTED DRAWING: Figure 1
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Inventors:
LAI ZHONG PING
ZHANG GUO XING
ZHANG GUO XING
Application Number:
JP2019058499A
Publication Date:
February 06, 2020
Filing Date:
March 26, 2019
Export Citation:
Assignee:
BGT MAT LTD
International Classes:
F21K9/232; F21V9/32; F21V19/00; F21V23/00; F21V29/503; F21V29/70; F21V29/85; F21V31/00; H01K1/04; H01K1/14; H01K1/18; H01L33/00; H01L33/50; H01L33/62; H01L33/64
Attorney, Agent or Firm:
Kenichi Fujii