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Title:
LIGHT-EMITTING DIODE ILLUMINATION MODULE
Document Type and Number:
Japanese Patent JP2005136224
Kind Code:
A
Abstract:

To provide a light-emitting diode illumination module which is easy to assemble, excellent in heat sink property, reliable, small, high usability and high illuminance.

The module is provided with a flexible wiring board, obtained by forming a circuit wiring 3 on a flexible board 2a, forming a flexible board 2b on it via an adhesive 8, and forming a flexible reflecting layer 7a reflecting light from the dice 1 of a light-emitting diode on it. A heat spreader 9, mounting the dice 1 of the light-emitting diode, is provided through the flexible wiring board. The dice 1 of the light-emitting diode is connected with the circuit wiring 3, provided on the flexible board 2a through a metal wire 5. In the flexible wiring board like this, an area provided with the heat spreader 9 is a part difficult to deform, and the other area is a part which is easy to deform.


Inventors:
YAMASHITA MASATAKA
Application Number:
JP2003371131A
Publication Date:
May 26, 2005
Filing Date:
October 30, 2003
Export Citation:
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Assignee:
ASAHI KASEI DENSHI KK
International Classes:
F21V29/00; F21S8/04; H01L33/62; H01L33/64; F21Y101/02; (IPC1-7): H01L33/00; F21S8/04; F21V29/00
Domestic Patent References:
JP2003092011A2003-03-28
JP2002232009A2002-08-16
JP2002335019A2002-11-22
JPS6185007U1986-06-04
JP2003235796A2003-08-26
JPH0334258U1991-04-04
JPH0537026A1993-02-12
JPS61160982A1986-07-21
JPH058541U1993-02-05
JP2001044512A2001-02-16
JPH10151804A1998-06-09
JP2000289250A2000-10-17
JPH10226107A1998-08-25
JP2002223007A2002-08-09
JP2003078174A2003-03-14
Attorney, Agent or Firm:
Yoshikazu Tani