Title:
発光素子およびその製造方法
Document Type and Number:
Japanese Patent JP6395913
Kind Code:
B2
Abstract:
A light emitting device includes a carrier, a light emitting chip, and a covering part disposed on the carrier. The carrier includes a board, a guiding metal layer, and a sealing material. The board has a first surface, a second surface, and a through vent that is divided into a first partial hole and a second partial hole. The first partial hole extends from the first surface to the second partial hole, and the second partial hole extends from the second surface to the first partial hole. The guiding metal layer is formed on the second surface and in the second partial hole, and covers the sidewall of the second partial hole. The guiding metal layer extends from the second partial hole to the second surface, and does not cover the sidewall of the first partial hole and the first surface. The sealing material seals the second partial hole.
Inventors:
Xie Sin
Kuregami
Kuregami
Application Number:
JP2017156799A
Publication Date:
September 26, 2018
Filing Date:
August 15, 2017
Export Citation:
Assignee:
Unikyo Optoelectronics Co., Ltd.
International Classes:
H01L33/48
Domestic Patent References:
| JP201472472A | ||||
| JP2006278865A |
Foreign References:
| US20120133268 |
Attorney, Agent or Firm:
Asahi Patent Office