発光素子モジュール - LG Innotek Co., Ltd

Title:

発光素子モジュール

Document Type and Number:

Japanese Patent JP5736257

Kind Code:

B2

Abstract:

A light emitting device module is provided comprising a light emitting device package and a printed circuit board to which the light emitting device package is coupled, wherein the light emitting device package includes a sliding groove and a fixing groove, or the light emitting device package provided a screw protrusion, and wherein the printed circuit board includes a sliding protrusion coupled to the sliding groove to guide the light emitting device package to a predetermined position and a fixing protrusion coupled to the fixing groove at the predetermined position, or the printed circuit board includes a screw groove to which the screw protrusion is coupled.

Inventors:

Moon, Yonte
Lee, Enson

Application Number:

JP2011149312A

Publication Date:

June 17, 2015

Filing Date:

July 05, 2011

Export Citation:

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