Title:
発光素子搭載用パッケージおよび発光装置
Document Type and Number:
Japanese Patent JP6893781
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a light-emitting element-mounting package with a high reflected light-condensing property, and a light-emitting device.SOLUTION: A light-emitting element-mounting package comprises: a substrate; a first pedestal; and a second pedestal. The substrate is shaped in a flat plate form. The first pedestal has a device-mount face to mount a light-emitting element on, which projects from a surface of the substrate. The second pedestal has an inclined plane which projects from the surface and which is provided adjacent to the first pedestal and inclined with respect to the first pedestal; a reflection face for reflecting light emitted by the light-emitting element to a direction which the surface fronts toward is provided on the inclined plane. The inclined plane is concave on a first pedestal side.SELECTED DRAWING: Figure 1A
Inventors:
Seika Okamoto
Izumi Taro Yamamoto
Yoji Kokubo
Izumi Taro Yamamoto
Yoji Kokubo
Application Number:
JP2016246818A
Publication Date:
June 23, 2021
Filing Date:
December 20, 2016
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01S5/02255; H01S5/02315; H01S5/02325
Domestic Patent References:
JP2006040933A | ||||
JP10173207A | ||||
JP60182781A | ||||
JP6037402A | ||||
JP2007141317A | ||||
JP2009152520A | ||||
JP11202165A |
Foreign References:
WO2013077199A1 | ||||
US20150124846 |
Attorney, Agent or Firm:
Sakai International Patent Office