Title:
発光素子パッケージ、及びこれを含む照明システム
Document Type and Number:
Japanese Patent JP6730017
Kind Code:
B2
Abstract:
A light emitting device package. The light emitting device package includes a package body, a light emitting device on the package body, a first molding member surrounding the light emitting device, and a second molding member having a hemispherical structure to surround the first molding member. The molding ember includes a viscous material.
Inventors:
Lee, Undeku
Oh, Junhoon
Oh, Junhoon
Application Number:
JP2015208299A
Publication Date:
July 29, 2020
Filing Date:
October 22, 2015
Export Citation:
Assignee:
LG Innotek Co., Ltd
International Classes:
H01L33/54; F21S2/00; H01L33/56
Domestic Patent References:
| JP2010010474A | ||||
| JP2014107502A | ||||
| JP2011049421A |
Foreign References:
| WO2013001687A1 | ||||
| KR1020070121423A | ||||
| US20140084322 | ||||
| DE102009018088A1 |
Attorney, Agent or Firm:
Makoto Ono
Kenkyo Kanayama
Kazuki Shigemori
Hidehiko Ichikawa
Yoshikazu Iwase
Kenkyo Kanayama
Kazuki Shigemori
Hidehiko Ichikawa
Yoshikazu Iwase