Title:
発光モジュールおよびその製造方法
Document Type and Number:
Japanese Patent JP7011201
Kind Code:
B2
Abstract:
To provide a light-emitting module capable of being made thin.SOLUTION: A light-emitting module comprises: a plurality of light-emitting elements 30 having a main light-emitting surface; a plurality of wavelength conversion members 20 arranged on the main light-emitting surfaces of the plurality of light-emitting elements; a resin member 50 arranged between the plurality of wavelength conversion members and covering the side surface of the wavelength conversion member; a light guide plate 10 having a first surface and a second surface, and arranged on the resin member and the plurality of wavelength conversion members so that the second surface faces the resin member and the plurality of wavelength conversion members, wherein the light guide plate has a plurality of concave parts located on the second surface on the plurality of wavelength conversion members.SELECTED DRAWING: Figure 2B
Inventors:
Mamoru Imada
Toshiaki Moriwaki
Yusaku Aji
Ryohei Yamashita
Toshiaki Moriwaki
Yusaku Aji
Ryohei Yamashita
Application Number:
JP2020132611A
Publication Date:
February 10, 2022
Filing Date:
August 04, 2020
Export Citation:
Assignee:
Nichia Corporation
International Classes:
F21S2/00; F21V7/00; F21V7/28; F21V9/32; G02B5/20; H01L33/50; H01L33/58
Domestic Patent References:
| JP2011165434A | ||||
| JP2011096494A |
Foreign References:
| WO2012141094A1 | ||||
| WO2015133045A1 |
Attorney, Agent or Firm:
Okuda Seiji
Kita Osamu
Kajitani Mido
Akiko Miyake
Yu Tanaka
Shigeyasu Murase
Hiroyuki Takeda
Kita Osamu
Kajitani Mido
Akiko Miyake
Yu Tanaka
Shigeyasu Murase
Hiroyuki Takeda
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