Title:
発光モジュールおよび発光モジュールの製造方法
Document Type and Number:
Japanese Patent JP7381937
Kind Code:
B2
Abstract:
A method for manufacturing a light-emitting module includes: providing a wiring substrate including: a base member having an upper surface, and a metal layer disposed on the upper surface of the base member; forming a resist layer on the wiring substrate such that the metal layer is exposed from the resist layer; disposing an intermediate body on the resist layer, the intermediate body comprising a light-emitting element and a covering layer; forming a bonding member; removing the resist layer and the covering layer; and forming a plating layer on a surface of the bonding member by plating, such that a portion of the plating layer is located between an electrode surface of the light-emitting element and the bonding member.
Inventors:
Kosuke Sato
Application Number:
JP2021210759A
Publication Date:
November 16, 2023
Filing Date:
December 24, 2021
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01L33/62; F21V19/00
Domestic Patent References:
| JP2021103774A | ||||
| JP2014045149A | ||||
| JP2015195244A | ||||
| JP2007324586A | ||||
| JP2013045943A | ||||
| JP2014160708A | ||||
| JP2014013818A | ||||
| JP2015156448A | ||||
| JP2008263154A | ||||
| JP2014150177A | ||||
| JP2003110148A | ||||
| JP2007242739A |
Foreign References:
| WO2006090834A1 | ||||
| US20190181315 | ||||
| CN113299814A |
Attorney, Agent or Firm:
Masahiko Hyugaji
Junichi Kozaki
Takato Uchida
Junichi Kozaki
Takato Uchida