To provide a resin sealed light emitting module having a cooling function.
A main body 1 of a light emitting module 100 has a resin sealed semiconductor light emitting element. On a surface of the main body 1, a Peltier module 2 is mounted. On a surface of the Peltier module 2, a metal sheet 3 is mounted. The Peltier module 2 has an upper surface and a lower surface which faces each other. The surface of the main body 1 is in contact with the lower surface of the Peltier module 2. The metal sheet 3 has a contact portion in contact with the upper surface of the Peltier module 2 and a non-contact portion which is not in contact with the upper surface. When a current flows in a predetermined direction, the Peltier module 2 absorbs heat generated in the semiconductor light emitting element via the lower surface and propagates the heat from the upper surface to the metal sheet 3. The heat in the semiconductor light emitting element is radiated by the Peltier module 2 and the metal sheet 3, thereby having the sufficient cooling function in spite of resin sealing.
| JPH08139343 | THERMOELECTRIC COOLING INFRARED DETECTOR |
| JP2737123 | [Title of Invention] Computer |
| JP2002247594 | IMAGE PICKUP DEVICE |
Tatsuya Shioda
Shiro Terasaki
Masatoshi Shibata
Ikeda adult
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