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Title:
LIGHT-EMITTING PANEL, AND MANUFACTURING METHOD OF LIGHT-EMITTING PANEL
Document Type and Number:
Japanese Patent JP2012058664
Kind Code:
A
Abstract:

To improve a yield by reducing a break at an intersecting part between an upper wiring and a lower wiring.

A light-emitting panel 10 comprises a lower wiring Ld formed on an upper part of a substrate 2, an insulation layer 31 for coating the lower wiring Ld, an upper wiring La formed on an upper part of the insulation layer 31 so as to intersect the lower wiring Ld, pixel transistors 11-13 connected to the lower wiring Ld and the upper wiring La, and an organic EL element 40 to which electric power is supplied by the pixel transistors 11-13. On an upper surface of the insulation layer 31 and an upper part of the lower wiring Ld, a protrusion strip along the lower wiring Ld is formed. The upper wiring La changes its width at least on a tilting surface 31B of the protrusion strip.


Inventors:
KOBAYASHI HIROKAZU
Application Number:
JP2010204334A
Publication Date:
March 22, 2012
Filing Date:
September 13, 2010
Export Citation:
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Assignee:
CASIO COMPUTER CO LTD
International Classes:
G09F9/30; H01L27/32; H01L51/50; H05B33/10; H05B44/00
Attorney, Agent or Firm:
Gwangyang International Patent Office