To provide a light receiving module capable of surely performing wire bonding between a light receiving element and the upper surface of a die cap capacitor and a method for manufacturing the light receiving module.
The light receiving module 1 has a stem 2 and the die cap capacitor 9 is formed on the stem 2. A notch 13 opened on the upper surface to prevent the flow of an adhesive is formed on an upper electrode 10 of the die cap capacitor 9. The light receiving element 14 for receiving an optical signal and converting the optical signal into an electric signal is fixed on the upper surface of the die cap capacitor 9 by using a die bonding material. The light receiving element 14 is electrically connected to the upper electrode 10 through a bonding wire 16. A preamplifier 25 for amplifying an output signal from the light receiving element 14 is formed on a position adjacent to the die cap capacitor 9 on the stem 2.
Tatsuya Shioda
Shiro Terasaki
Masatoshi Shibata
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