To provide a light source device employing an LED and having a sufficient luminance by treating heat increased due to the contriving of obtaining of a high luminance of the semiconductor element of recent years or the LED in the mounting of a flip chip, and to provide a projector employing the light source device.
Filler FL having a heat conductivity is poured into the periphery of a solder ball SB for connecting between the LED or the like in the mounting of the flip chip or the like or the semiconductor element and a semiconductor mounting substrate whereby heat generated from not only the solder ball SB but also from the LED element 1 due to heat conduction by the filler FL, is excluded to the outside of the light source device. According to this method, heat conductivity between the semiconductor element such as the LED or the like in the mounting of flip chip and the semiconductor mounting substrate is increased.
Fujitsuna Hideyoshi
Osamu Suzawa