LIGHT WAVE DETECTOR

Japanese Patent JP3852011

B2

PROBLEM TO BE SOLVED: To thermally insulate a heat sensitive part, and to stoutly support the heat sensitive part.
SOLUTION: A substrate side insulation layer (50) having a holding space (12) for hollowly holding the heat sensitive part (20) is stacked on a substrate (30). A heat sensitive part side insulation layer (70) to which the heat sensitive part (20) is attached is connected to the substrate side insulation layer (50) via support legs (60) consisting of an insulation member so as to be positioned in the holding space (12). The support leg (60) extends from one end connected to the substrate side insulation layer (50) to the rear side of the heat sensitive part side insulation layer (70). In the support leg (60), the thickness dimension s with respect to the direction perpendicular to a light receiving surface (21) of the heat sensitive part (20) is larger than the width dimension t with respect the direction of the light receiving surface (21). The substrate side insulation layer (50) is formed in a rectangular frame. The support leg (60) passes through the rear surface of the heat sensitive part side insulation layer (70) from a corner part of the substrate side insulation layer (50) to which one end is connected, and the other end is connected to the facing corner part of the substrate side insulation layer (50). The two support legs (60) are disposed in the cross shape.

Mizonobe Kiyoshi
Kazufumi Ohashi

JP2004007942A

November 29, 2006

January 15, 2004

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Daikin Industries, Ltd.

G01J1/02; G01J5/02; H01L27/14; H01L37/02; (IPC1-7): G01J1/02; H01L27/14

JP7225152A
JP2001041818A
JP6138427A
JP8285680A
JP1308926A

Hiroshi Maeda
Hiroshi Koyama
Hiroshi Takeuchi
Yuji Takeuchi
Katsumi Imae
Tomoo Harada

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