Title:
発光ダイオードに基づく照明組立体
Document Type and Number:
Japanese Patent JP2007513520
Kind Code:
A
Abstract:
An illumination assembly includes a substrate having an electrically insulative layer on a first side of the substrate and an electrically conductive layer on a second side of the substrate. A plurality of LED dies is disposed on the substrate. Each LED die is disposed in a via extending through the electrically insulative layer on the first side of the substrate to the electrically conductive layer on the second side of the substrate. Each LED die is operatively connected through the via to the electrically conductive layer.
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| WO/2012/072127 | LED LIGHT BULB |
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| WO/2001/048421 | LIGHT FITTING |
Inventors:
Schulz, John See.
Larson, Donald K.
Miller, Michael N.
Larson, Donald K.
Miller, Michael N.
Application Number:
JP2006542591A
Publication Date:
May 24, 2007
Filing Date:
November 09, 2004
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES COMPANY
International Classes:
F21K99/00; F21S8/04; F21V19/00; F21V29/00; H01L25/075; H05K1/00; H05K1/02; H05K1/18; F21Y101/02; H01L33/62; H05K1/05
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Yoshihiro Kobayashi
Takashi Ishida
Tetsuji Koga
Yoshihiro Kobayashi