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Title:
LIGHTING DEVICE AND LUMINAIRE
Document Type and Number:
Japanese Patent JP2016207309
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To achieve reduction in stress applied to a printed wiring board and solder.SOLUTION: In a printed wiring board 800, a circuit component (semiconductor component 801A) whose calorific value is relatively large is mounted near a first end part. A coupling member 802 is made of a metal plate material and has: a body part 8020 in which the circuit component (semiconductor part 801A) whose calorific value is relatively large is mechanically coupled; and one or a plurality of fixing parts 8021 protruding from the body part 8020 and fixed near the first end part of the printed wiring board 800. The body part 8020 is constituted so as to be mechanically coupled with a case body 82. A reinforcement member 804 is fixed to a third end part and a fourth end part along a shorter direction of the printed wiring board 800.SELECTED DRAWING: Figure 4

Inventors:
NAKASHIRO AKIRA
SATAKE KAZUYASU
HOASHI JUNJI
NAGAO JINTARO
NISHIDA NORIAKI
TAKIKITA HISAYA
DOI KATSUYUKI
YOSHITANI NAOKI
Application Number:
JP2015084462A
Publication Date:
December 08, 2016
Filing Date:
April 16, 2015
Export Citation:
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Assignee:
PANASONIC IP MAN CORP
International Classes:
F21V23/00; F21V15/01; F21V29/508
Domestic Patent References:
JP2009054489A2009-03-12
JP2008084540A2008-04-10
JPH11214806A1999-08-06
Attorney, Agent or Firm:
Keisei Nishikawa
Takeshi Sakaguchi
Hidetoshi Kitade
Nakaishi Haruki