LIGHTWEIGHT BOARD, MANUFACTURING METHOD THEREOF, AND STRUCTURAL MATERIAL

Japanese Patent JP2022080629

A

To provide a lightweight board having a high surface rigidity and excellent toughness, a manufacturing method thereof, and a structural material.SOLUTION: There is provided a lightweight board that is obtained by: impregnating a thermosetting resin into a glass cloth; and laminating a surface layer material 12 performed of a hot-press molding and has a thickness of 0.2 mm or more and 2.0 mm or less onto the front and back sides of a plastic foam body (foam body 11) with a foam ratio of 5 times or more and 20 times or less by using an adhesive having 100% solid content, in which the plastic foam body is a polycarbonate resin. A basis weight of the glass cloth may be in a range of 50 g/m2 or more and 200 g/m2 or less. The thermosetting resin may be one kind of resin selected from an epoxy-based resin, phenol-based resin, a polyester-based resin, a diallyl-phthalate-based resin, or a mixture of two or more kinds thereof. The number of laminated glass cloths may be one or more. The adhesive having 100% solid content may be an urethane-based resin or an epoxy-based resin.SELECTED DRAWING: Figure 1

JPS6036212	[Title of the Invention] Combustion Lateness epoxy resin
JP2000124613	MULTILAYER PRINTED WIRING BOARD AND ITS MANUFACTURE
JPH1061091	PLATE MATERIAL OF FURNITURE, ETC., AND MANUFACTURE THEREOF

MORITA YOICHI
HAYAKAWA TSUKASA
KOGURE NAOCHIKA
TOMORI ITARU
TAKAHASHI SEIJI

JP2020191814A

May 30, 2022

November 18, 2020

Click for automatic bibliography generation  

TOPPAN PRINTING CO LTD
JSP CORP

B32B17/04; B32B5/24; B32B27/36

Hirose Hajime
Miyasaka Tohru

Previous Patent: Semiconductor device

Next Patent: Process analysis device, process analysis method, and process analysis program